SAIC

A thermal-shock chamber (TSC) is not an off-the-shelf climatic box. Its only purpose is to generate controlled temperature gradients and rapid transfer rates that reveal thermo-mechanical defects. A poor choice will distort test data, delay R&D, fail certification audits, or even trigger a product recall. This paper translates field experience into an engineering checklist for R&D, Quality and ESS engineers.

The thermal shock chamber (TSC) is a cornerstone instrument in environmental-reliability testing. By exposing a specimen to rapid alternations between extremely high and extremely low temperatures, it reproduces the severe thermal excursions encountered during service or transport.

After putting a high and low temperature test chamber into operation, is it normal for the equipment to exhibit significant temperature fluctuations? This may indicate a malfunction, requiring prompt troubleshooting and resolution.

The sand and dust test chamber is used to evaluate the sealing performance of factory-produced products by simulating the erosion caused by natural wind and sand climates.

In generic reliability standards such as GB/T 2423, IEC 60068 and MIL-STD-810, “damp heat” is treated as an independent climatic stress. The goal is not merely to verify moisture resistance, but to accelerate and expose failure modes triggered by water adsorption, condensation, “breathing” and electrochemical migration.