SAIC

A thermal-shock chamber (TSC) is not an off-the-shelf climatic box. Its only purpose is to generate controlled temperature gradients and rapid transfer rates that reveal thermo-mechanical defects. A poor choice will distort test data, delay R&D, fail certification audits, or even trigger a product recall. This paper translates field experience into an engineering checklist for R&D, Quality and ESS engineers.

Sand and dust test chambers primarily simulate sandstorm climates to test the dust-proof performance and IP dust-proof ratings of products and materials such as electric meters, outdoor lighting, signaling devices, automotive components, and locks.

Sudden power outages can have certain impacts on low-temperature test chambers, whether caused by human factors or other reasons.

Rain test chambers are used to evaluate the waterproofing parameters and performance of automotive components, low-voltage electrical enclosures, and other products. These devices simulate relevant environmental conditions for testing.

In the field of environmental reliability testing, thermal shock test chambers are widely used to evaluate the adaptability and lifetime degradation of electronic components, materials, and complete products under rapid and extreme temperature transients.