In the daily use of the constant temperature and humidity test chamber, due to operational errors or a lack of regular maintenance, the equipment may occasionally experience faults, thereby disrupting the normal workflow.
Many customers tend to think that once they purchase a high-low temperature test chamber, they can rest easy and need not worry anymore. However, in actual operation, the equipment may encounter various unexpected situations.
A thermal-shock chamber (TSC) is not an off-the-shelf climatic box. Its only purpose is to generate controlled temperature gradients and rapid transfer rates that reveal thermo-mechanical defects. A poor choice will distort test data, delay R&D, fail certification audits, or even trigger a product recall. This paper translates field experience into an engineering checklist for R&D, Quality and ESS engineers.
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